For some years now, researchers at Tecplot have been collaborating with a group at the Colorado School of Mines on a project, led by Dr. Mark Eberhart, to develop predictive software that can compute the bulk properties of materials from the electronic structure.
The latest findings of the Tecplot Bondalyzer project have been published in the January issue of ChemPhysChem1.
Previously referred to as Tecplot ChemBond, the 2012 blog, New visualization software helps create stronger metals, refers to the initial paper, Better Alloys with Quantum Design, published through the American Physical Society.
So the project once called Tecplot ChemBond has become the Tecplot Bondalyzer.
1Miorelli, J., Wilson, T., Morgenstern, A., Jones, T. and Eberhart, M. E. (2015), Back Cover: A Full Topological Analysis of Unstable and Metastable Bond Critical Points (ChemPhysChem 1/2015). ChemPhysChem, 16: 260. doi: 10.1002/cphc.201590005